The performance of the micro-chip is affected by overheating and hence reduces the efficiency of electronic devices. The development of high thermal conductivity material can solve problems associated with dissipation of heat from the micro-chips. Thermal conductivity for carbon nanotubes (CNTs) are in the ranges of 1200-3000 W/m°K which considered as the best candidate material for heat sink applications. This research investigates the fabrication of CNTs reinforced copper composites using powder metallurgy method. Copper powder and CNTs were ball milled to prepare mixtures and compacted at 600 MPa to fabricate test samples. The compacted test samples were sintered in argon atmosphere at 850°C. Sintered density of CNTs/Cu composites was measured and compared with theoretical density. Density data showed that 98 sintered density was achieved. Optical and scanning electron microscopic (SEM) examination of sintered compacts showed good grain growth, however porosity was also noted in sintered samples. Field emission scanning electron microscopy (FESEM) showed well dispersion of CNTs in copper matrix and interfacial bonding between copper particle and CNTs. In this experiment, the addition of 2 vol. CNTs in copper matrix showed 9 increase in thermal conductivity approximately compared to thesintered pure copper. © (2014) Trans Tech Publications, Switzerland.