Experimental Research and Multi-Physical Field Coupling Simulation of Electrochemical Machining Based on Gas–Liquid Two-Phase Flow

by Zhaolong Li, Wangwang Li, Ye Dai
Published 2022-02-01

Simulation Analysis of Multi-Physical Field Coupling and Parameter Optimization of ECM Miniature Bearing Outer Ring Based on the Gas-Liquid Two-Phase Turbulent Flow Model

by Zhaolong Li, Wangwang Li, Bingren Cao
Published 2022-06-01

Fatigue behavior of reinforced UHPC-NC composite beams

by Jue Wang, Wenyu Ji, Mingzhe An, Wangwang Li
Published 2023-07-01

Experimental Research on Fatigue Behavior of Reinforced UHPC-NC Composite Beams under Cyclic Loading

by Jue Wang, Wenyu Ji, Wangwang Li, Tibo Zhao
Published 2024-02-01

Simulation and experiment of ECM accuracy of cooling holes considering the influence of temperature field

by Zhaolong Li, Wangwang Li, Bingren Cao, Yingtao Liu, Ye Dai
Published 2022-07-01

Study of heat transfer performance of miniature heat sink for integrated circuit packaging field

by Zhaolong Li, Wangwang Li, Yingtao Liu, Meng Xun, Mengchen Yuan
Published 2023-09-01

Exact Dynamic Characteristic Analysis of Steel-Concrete Composite Continuous Beams

by Qikai Sun, Nan Zhang, Guobing Yan, Xinqun Zhu, Xiao Liu, Wangwang Li
Published 2021-01-01

Kernel Reverse Neighborhood Discriminant Analysis

by Wangwang Li, Hengliang Tan, Jianwei Feng, Ming Xie, Jiao Du, Shuo Yang, Guofeng Yan
Published 2023-03-01

Discrepancy of Growth Toxicity of Polystyrene Nanoplastics on Soybean (<i>Glycine max</i>) and Mung Bean (<i>Vigna radiata</i>)

by Dan Su, Wangwang Li, Zhaowei Zhang, Hui Cai, Le Zhang, Yuanlong Sun, Xiaoning Liu, Zhiquan Tian
Published 2024-02-01

Quantitative Analysis of Piezoresistive Characteristic Based on a P-type 4H-SiC Epitaxial Layer

by Yongwei Li, Ting Liang, Cheng Lei, Yingping Hong, Wangwang Li, Zhiqiang Li, Abdul Ghaffar, Qiang Li, Jijun Xiong
Published 2019-09-01

Passive Resistor Temperature Compensation for a High-Temperature Piezoresistive Pressure Sensor

by Zong Yao, Ting Liang, Pinggang Jia, Yingping Hong, Lei Qi, Cheng Lei, Bin Zhang, Wangwang Li, Diya Zhang, Jijun Xiong
Published 2016-07-01

Interface Characteristics of Sapphire Direct Bonding for High-Temperature Applications

by Wangwang Li, Ting Liang, Yulei Chen, Pinggang Jia, Jijun Xiong, Yingping Hong, Cheng Lei, Zong Yao, Lei Qi, Wenyi Liu
Published 2017-09-01