Study of robust package strength characterization of memory packages for handheld application

by Vance Liu, Chien-Ming Chen, Joyce Chen, Min-Hua Chung, Chong Leong Gan
Published 2022-12-01

Technological sustainable materials and enabling in semiconductor memory industry: A review

by Chong Leong Gan, Min-Hua Chung, Yung-Sheng Zou, Chen-Yu Huang, Hem Takiar
Published 2023-09-01