Numerical Investigation of Liquid Carryover in T-Junction with Different Diameter Ratios Academic Article

http://dx.doi.org/10.1088/1757-899x/328/1/012007

authors

Pao, William King Soon
Sam, Ban
Saieed, Ahmed
Tran, Cong Minh

publication date

2018

published in

IOP Conference Series: Materials Science and Engineering Journal

Digital Object Identifier (DOI)

https://doi.org/10.1088/1757-899x/328/1/012007

start page

012007

volume

328