Items where Author is "Majid, M.F.M.A."
![[up]](/style/images/multi_up.png)
Up a levelGroup by: Item Type | No Grouping
Jump to: Conference or Workshop Item
Number of items: 1.
Conference or Workshop Item
Majid, M.F.M.A. and Khor, C.Y. and Abdullah, M.K. and Abdullah, M.Z. and Rahiman, W.Y. and Jappar, A. and Aris, M.S. (2012) Three dimensional numerical prediction of epoxy flow during the underfill process in flip chip packaging. In: UNSPECIFIED.