TY  - CONF
A1  - Rahman, Z.H.A.
A1  - Khir, M.H.M.
A1  - Zakariya, M.A.
N2  - The residual stress is often due to a thermal mismatch in the thermal expansion coefficient (CTE) between the two materials. This phenomenon causes device failure such as curling, buckling, and also fracture upon releasing. Hence, strategies are needed to minimize the effect of residual stress on the induced beam bending upon release of the device. In this paper, four different geometrical structures are studied theoretically and simulated. The stress level is deduced by measuring the deflection of the beam. The result has shown that the beam with Al and SiO2 strip arranged alternately as the top layer and SiO2 as the bottom layer have the least downward deflection upon applied temperature. For T = 50 K, deflection of 0.8425 μm is measured. Simulation-based of varying thickness also show that having thicker SiO2 (with a similar total thickness of the beam) contribute to smaller downward deflection and least percentage error between theoretical and simulation result. Surface stress analysis also shows that the stress measured is 107.86 MPa, which is lower than the yield strength of Al and SiO2 materials. © 2018 IEEE.
N1  - cited By 1; Conference of 13th IEEE International Conference on Semiconductor Electronics, ICSE 2018 ; Conference Date: 15 August 2018 Through 17 August 2018; Conference Code:140535
Y1  - 2018///
EP  - 84
SP  - 81
SN  - 9781538652831
VL  - 2018-A
TI  - Tip deflection of a thermal bimorph cantilever beam with different geometrical structures
PB  - Institute of Electrical and Electronics Engineers Inc.
ID  - scholars9888
UR  - https://www.scopus.com/inward/record.uri?eid=2-s2.0-85056250789&doi=10.1109%2fSMELEC.2018.8481310&partnerID=40&md5=7af8a6aab791ca47e7b845e04198be7c
KW  - Geometry; Residual stresses; Silica; Stress analysis; Thermal expansion
KW  -  bimetallic; Bimorph cantilever; Device failures; Geometrical structure; Percentage error; Thermal expansion coefficients; Thermal mismatch; Varying thickness
KW  -  Deflection (structures)
AV  - none
ER  -