relation: https://khub.utp.edu.my/scholars/9794/ title: Metal Injection Molding Process Parameters as A Function of Filling Performance of 3D Printed Polymer Mold creator: Qayyum, J.A. creator: Altaf, K. creator: Rani, A.M.A. creator: Ahmad, F. creator: Qadir, H.A. creator: Amin, W. description: Metal injection molding (MIM) is a swift manufacturing process, which can produce complex and intricate parts with good repeatability and accuracy. However, to quickly address low-volume demands of customized MIM parts, manufacturing of mold could be a potential challenge. Typically, machined metal molds are used for MIM, but they are expensive and need more lead time. The machined metal mold becomes useless once the design is changed or requirement of MIM parts is met. Therefore, for MIM production of a low volume of highly customized parts, machined metal mold could be substituted by 3D printed polymer molds. However, knowledge of filling behavior of MIM feedstock in polymer mold is a grey area, which demands study to investigate the effects of injection parameters on mold filling. The present study investigates the effects of machine injection parameters on feedstock filling behavior in 3D printed polymer molds. An attempt has been made to determine the trend of feedstock filling in the polymer mold as a function of injection parameters. Further, the design of experiment (DOE) has been used to estimate the weight of injection parameters. © 2018 The Authors, published by EDP Sciences. publisher: EDP Sciences date: 2018 type: Conference or Workshop Item type: PeerReviewed identifier: Qayyum, J.A. and Altaf, K. and Rani, A.M.A. and Ahmad, F. and Qadir, H.A. and Amin, W. (2018) Metal Injection Molding Process Parameters as A Function of Filling Performance of 3D Printed Polymer Mold. In: UNSPECIFIED. relation: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85056758532&doi=10.1051%2fmatecconf%2f201822506004&partnerID=40&md5=7c4920e006b37be7613497bf24a5fe76 relation: 10.1051/matecconf/201822506004 identifier: 10.1051/matecconf/201822506004