@inproceedings{scholars9656, journal = {International Conference on Intelligent and Advanced System, ICIAS 2018}, publisher = {Institute of Electrical and Electronics Engineers Inc.}, title = {Miniaturized Reconfigurable Conductor-Backed Coplanar Waveguide Bandpass Filter}, note = {cited By 3; Conference of 7th International Conference on Intelligent and Advanced System, ICIAS 2018 ; Conference Date: 13 August 2018 Through 14 August 2018; Conference Code:143005}, year = {2018}, doi = {10.1109/ICIAS.2018.8540614}, abstract = {In this paper, we present the analysis and design of a miniaturized reconfigurable bandpass filter based on a 3 rd order coupled conductor backed coplanar waveguide transmission line structure. The main objective of the paper is to provide a comprehensive design analysis, development and optimization of miniaturized bandpass filter with application in the RF/Microwave and other wireless communication systems. The proposed miniaturized reconfigurable bandpass filter is specifically designed for wireless communication at the center frequency of 30 GHz. The conductor-backed coplanar waveguide design approach allows for the elimination of via holes; hence, easy to fabricate, cost effective and reduces parasitic in the filter. The transmission lines are patterned on a silicon dioxide placed on a silicon substrate with the dielectric constant of Er11.9. The filter occupies total chip area of 1.3x 0.76mm. The 3D structure is designed and simulated in CST. The result shows the achieved inband insertion loss of less than 2 dB and return loss better than 15 dB. {\^A}{\copyright} 2018 IEEE.}, keywords = {Bandpass filters; Coplanar waveguides; Cost effectiveness; Electric lines; Mobile telecommunication systems; Silica; Structural design, combline; Comprehensive designs; Conductor backed coplanar waveguides; Miniaturized bandpass filters; Silicon substrates; Transmission line modeling; Wireless communication system; Wireless communications, Waveguide filters}, url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-85059760051&doi=10.1109\%2fICIAS.2018.8540614&partnerID=40&md5=ca0b7d166d0631c08498f82d42e32080}, isbn = {9781538672693}, author = {Lawal, B. and Dennis, J. O. and Sovuthy, C.} }