eprintid: 739
rev_number: 2
eprint_status: archive
userid: 1
dir: disk0/00/00/07/39
datestamp: 2023-11-09 15:48:53
lastmod: 2023-11-09 15:48:53
status_changed: 2023-11-09 15:23:04
type: article
metadata_visibility: show
creators_name: Verma, P.
creators_name: Chatterjee, D.
creators_name: Nagarajan, T.
title: Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling
ispublished: pub
keywords: Conical diffusers; Control electronics; Design and Development; Electronic cooling; Fluidic components; Input voltages; Integrated cooling; Integrated thermal management systems; Maximum flowrate; Maximum power; Micro pumps; Mini channels; Modular; Modular units; Piezoelectric; Piezoelectric actuations; Power levels; Pressure heads; Pulsating flows; Signal conditioning; Surface temperatures; Valveless micropump; Working fluids, Cooling; Cooling systems; Electromagnetic wave emission; Ethanol; Heat sinks; Piezoelectric transducers; Piezoelectricity; Printed circuit design; Printed circuit manufacture; Pumps; Temperature control, Printed circuit boards
note: cited By 23
abstract: With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump-heat exchanger on a printed circuit board is investigated for electronic cooling. Signal conditioning and control electronics are integrated with the fluidic components on the substrate to form a compact modular unit. Piezoelectric actuation and conical diffusers are utilized to generate pulsating flow through a minichannel heat sink. With ethanol as the working fluid, the tested pump reached a maximum flowrate and a pressure head of 2.4 ml/min and 743 Pa at an input voltage of 6 VDC. Suitability of the system for active real-time temperature control has been demonstrated at two input heater power levels of 1.45 and 2.5W A maximum reduction of 57 per cent in the average heat sink surface temperature could be achieved at a maximum power consumption of 150 mW by the micropump. © IMechE 2009.
date: 2009
official_url: https://www.scopus.com/inward/record.uri?eid=2-s2.0-64549162388&doi=10.1243%2f09544062JMES1315&partnerID=40&md5=0b7c54885432efca6a7542c4e05d9f85
id_number: 10.1243/09544062JMES1315
full_text_status: none
publication: Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
volume: 223
number: 4
pagerange: 953-963
refereed: TRUE
issn: 09544062
citation:   Verma, P. and Chatterjee, D. and Nagarajan, T.  (2009) Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling.  Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 223 (4).  pp. 953-963.  ISSN 09544062