<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling"^^ . "With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump-heat exchanger on a printed circuit board is investigated for electronic cooling. Signal conditioning and control electronics are integrated with the fluidic components on the substrate to form a compact modular unit. Piezoelectric actuation and conical diffusers are utilized to generate pulsating flow through a minichannel heat sink. With ethanol as the working fluid, the tested pump reached a maximum flowrate and a pressure head of 2.4 ml/min and 743 Pa at an input voltage of 6 VDC. Suitability of the system for active real-time temperature control has been demonstrated at two input heater power levels of 1.45 and 2.5W A maximum reduction of 57 per cent in the average heat sink surface temperature could be achieved at a maximum power consumption of 150 mW by the micropump. © IMechE 2009."^^ . "2009" . . "223" . "4" . . "Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science"^^ . . . "09544062" . . . . . . . . . . . . . "P."^^ . "Verma"^^ . "P. Verma"^^ . . "D."^^ . "Chatterjee"^^ . "D. Chatterjee"^^ . . "T."^^ . "Nagarajan"^^ . "T. Nagarajan"^^ . . . . . "HTML Summary of #739 \n\nDesign and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling\n\n" . "text/html" . .