relation: https://khub.utp.edu.my/scholars/739/
title: Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling
creator: Verma, P.
creator: Chatterjee, D.
creator: Nagarajan, T.
description: With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump-heat exchanger on a printed circuit board is investigated for electronic cooling. Signal conditioning and control electronics are integrated with the fluidic components on the substrate to form a compact modular unit. Piezoelectric actuation and conical diffusers are utilized to generate pulsating flow through a minichannel heat sink. With ethanol as the working fluid, the tested pump reached a maximum flowrate and a pressure head of 2.4 ml/min and 743 Pa at an input voltage of 6 VDC. Suitability of the system for active real-time temperature control has been demonstrated at two input heater power levels of 1.45 and 2.5W A maximum reduction of 57 per cent in the average heat sink surface temperature could be achieved at a maximum power consumption of 150 mW by the micropump. © IMechE 2009.
date: 2009
type: Article
type: PeerReviewed
identifier:   Verma, P. and Chatterjee, D. and Nagarajan, T.  (2009) Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling.  Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 223 (4).  pp. 953-963.  ISSN 09544062     
relation: https://www.scopus.com/inward/record.uri?eid=2-s2.0-64549162388&doi=10.1243%2f09544062JMES1315&partnerID=40&md5=0b7c54885432efca6a7542c4e05d9f85
relation: 10.1243/09544062JMES1315
identifier: 10.1243/09544062JMES1315