@inproceedings{scholars7086,
           title = {Investigation on thermocompression bonding using lead free sinterable paste and high lead solder paste for power QFN application},
       publisher = {EDP Sciences},
         journal = {MATEC Web of Conferences},
             doi = {10.1051/matecconf/20165103009},
            year = {2016},
            note = {cited By 0; Conference of International Conference on Mechanical, Manufacturing, Modeling and Mechatronics, IC4M 2016 ; Conference Date: 27 February 2016 Through 29 February 2016; Conference Code:121447},
          volume = {51},
            issn = {2261236X},
          author = {Chandrakasan, G. and Ovinis, M.},
        keywords = {Chemical bonds; Dies; Electronics packaging; High temperature effects; Lead; Manufacture; Sintering; Soldering alloys; Viscosity, Critical elements; High temperature materials; Operating temperature; Peak temperatures; Semiconductor assembly; Thermal Performance; Thermo compression bonding; Thermo-compression, Lead-free solders},
             url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-84969975703&doi=10.1051\%2fmatecconf\%2f20165103009&partnerID=40&md5=3304536a7783d0c00ab0eac484a1f2b3},
        abstract = {Persistently growing Power QFN packages are used in various fields especially micro-electronics, aerospace, oil and gas as well. However, the particular industries is pushing forward to reduce the use of hazardous materials in the process of manufacturing and assemblies. Thermo-compression die-attach layer is perceived to be the most critical element in power QFN packages as the increase in operating temperature requires new materials with suitable thermo-chemical properties also with suitable melting points of next generation lead free die attachment material. In this situation, Hi-lead solder (RM218: Pb92.5Sn5Ag2.5) which known as high temperature material is widely being used in most semiconductor assembly for die attach, yet it deduce few reliability challenges like solder voids, the clip tilt performance and also solder splash which has been considered as major quality issue in assembly of Power QFN packages (FET die, IC die and clip attach). As a solution, sintering epoxy paste (SPC073- 3: Sn96.5/Ag3/Cu0.5) is being considered as a replacement. In this case, sintering epoxy paste demonstrating excellent electrical and thermal performance for Power QFN packages which is known to be demanded in market. Thus, this study investigates the differential pastes sintering paste and also solder paste, in order to identify best die attachment material to be used in thermo-compression bonding method. Therefore, the shear strength was resulting good indication where the sintering paste was recorded 2.4 Kg/mm meanwhile the solder paste was recorded 0Kg/mm at peak temperature of 260{\^A}oC. Besides of that, the pot life seems promising as the sintering paste seems to have constant viscosity of 100Pa{\^a}??s throughout the 48 hours tested while, high lead solder paste records viscosity from 100Pa{\^a}??s marginally increase as the time increase which effects the inconsistency of pot life. Last but not least, the voids mechanisms proves sintering epoxy paste has the same pinhole voids as its individual, but the solder paste's pinhole voids are not same as individuals which easily can fail when the particular shear force was applied. Hence, sintering epoxy paste could resolve the quality issue by using thermo-compression bonding method and produce the better reliability than the solder paste. {\^A}{\copyright} 2016 Owned by the authors, published by EDP Sciences.}
}