TY  - CONF
UR  - https://www.scopus.com/inward/record.uri?eid=2-s2.0-84962027616&doi=10.1109%2fULTSYM.2015.0362&partnerID=40&md5=83a99f813178e28a58277d041eee5a12
A1  - Pandian, M.S.
A1  - Marigo, E.
A1  - Shunmugam, M.
A1  - Hussain, R.B.
A1  - Song, C.T.W.
A1  - Din, J.B.J.
A1  - Fei, C.B.
A1  - Madhaven, V.
A1  - Kantimahanti, A.K.
A1  - Malik, A.F.
A1  - Jeoti, V.
Y1  - 2015///
SN  - 9781479981823
PB  - Institute of Electrical and Electronics Engineers Inc.
N1  - cited By 4; Conference of IEEE International Ultrasonics Symposium, IUS 2015 ; Conference Date: 21 October 2015 Through 24 October 2015; Conference Code:118680
N2  - In this paper we present a study on the surface acoustic wave propagation performance and coupling coefficient for a non-planar thin film Surface Acoustic Wave device (SAW). Piezoelectric Aluminum Nitride (AlN) thin film is deposited on top of the Inter Digital Transducer (IDT) by a non conformal physical vapor deposition process. Non-planarity around the transducer impedes the wave propagation, this effect is investigated using SAW delay lines. © 2015 IEEE.
KW  - Acoustic surface wave devices; Acoustic waves; Acoustics; Aluminum; Aluminum coatings; Aluminum nitride; Deposition; Nitrides; Physical vapor deposition; Piezoelectricity; Thin film devices; Thin films; Transducers; Ultrasonic transducers; Vapor deposition
KW  -  Aluminum nitride (AlN); Coupling coefficient; Interdigital transducer; Physical vapor deposition process; Piezoelectric thin film devices; SAW delay line; Surface acoustic wave propagation; Thin film surfaces
KW  -  Acoustic wave propagation
TI  - Investigation on Surface Acoustic Wave propagation for a non-planar piezoelectric thin film device
ID  - scholars5620
AV  - none
ER  -