eprintid: 5590
rev_number: 2
eprint_status: archive
userid: 1
dir: disk0/00/00/55/90
datestamp: 2023-11-09 16:17:20
lastmod: 2023-11-09 16:17:20
status_changed: 2023-11-09 16:03:15
type: article
metadata_visibility: show
creators_name: Muthuvalu, M.S.
creators_name: Asirvadam, V.S.
creators_name: Mashadov, G.
title: Performance analysis of Arithmetic Mean method in determining peak junction temperature of semiconductor device
ispublished: pub
keywords: Finite difference method; Heat conduction; Iterative methods; Microelectronics; Numerical methods; Reliability, Arithmetic mean method; Heat conduction equations; Junction temperatures; Mathematical approach; Micro-electronic devices; Numerical approaches; Peak junction temperature; Performance analysis, Semiconductor junctions
note: cited By 3
abstract: High reliability users of microelectronic devices have been derating junction temperature and other critical stress parameters to improve device reliability and extend operating life. The reliability of a semiconductor is determined by junction temperature. This paper gives a useful analysis on mathematical approach which can be implemented to predict temperature of a silicon die. The problem could be modeled as heat conduction equation. In this study, numerical approach based on implicit scheme and Arithmetic Mean (AM) iterative method will be applied to solve the governing heat conduction equation. Numerical results are also included in order to assert the effectiveness of the proposed technique. © 2015 Faculty of Engineering, Ain Shams University.
date: 2015
publisher: Ain Shams University
official_url: https://www.scopus.com/inward/record.uri?eid=2-s2.0-84959573705&doi=10.1016%2fj.asej.2015.04.007&partnerID=40&md5=470d9370541546c69be91fcaf46fd6ee
id_number: 10.1016/j.asej.2015.04.007
full_text_status: none
publication: Ain Shams Engineering Journal
volume: 6
number: 4
pagerange: 1203-1210
refereed: TRUE
issn: 20904479
citation:   Muthuvalu, M.S. and Asirvadam, V.S. and Mashadov, G.  (2015) Performance analysis of Arithmetic Mean method in determining peak junction temperature of semiconductor device.  Ain Shams Engineering Journal, 6 (4).  pp. 1203-1210.  ISSN 20904479