TY  - JOUR
N1  - cited By 0
TI  - Experimental investigation on thermal conduction of carbon nanotubes reinforced copper matrix composites
SN  - 16609336
JF  - Applied Mechanics and Materials
EP  - 460
UR  - https://www.scopus.com/inward/record.uri?eid=2-s2.0-84903531108&doi=10.4028%2fwww.scientific.net%2fAMM.564.455&partnerID=40&md5=16bfe643cd624ab741fa1823220aafc3
N2  - The performance of the micro-chip is affected by overheating and hence reduces the efficiency of electronic devices. The development of high thermal conductivity material can solve problems associated with dissipation of heat from the micro-chips. Thermal conductivity for carbon nanotubes (CNTs) are in the ranges of 1200-3000 W/m°K which considered as the best candidate material for heat sink applications. This research investigates the fabrication of CNTs reinforced copper composites using powder metallurgy method. Copper powder and CNTs were ball milled to prepare mixtures and compacted at 600 MPa to fabricate test samples. The compacted test samples were sintered in argon atmosphere at 850°C. Sintered density of CNTs/Cu composites was measured and compared with theoretical density. Density data showed that 98 sintered density was achieved. Optical and scanning electron microscopic (SEM) examination of sintered compacts showed good grain growth, however porosity was also noted in sintered samples. Field emission scanning electron microscopy (FESEM) showed well dispersion of CNTs in copper matrix and interfacial bonding between copper particle and CNTs. In this experiment, the addition of 2 vol. CNTs in copper matrix showed 9 increase in thermal conductivity approximately compared to thesintered pure copper. © (2014) Trans Tech Publications, Switzerland.
ID  - scholars5246
AV  - none
Y1  - 2014///
KW  - Carbon nanotubes; Copper; Copper powder; Dispersions; Field emission microscopes; Grain growth; Industrial engineering; Metallic matrix composites; Microstructure; Powder metallurgy; Reinforced plastics; Reinforcement; Sintering
KW  -  Copper composites; Copper matrix composite; Experimental investigations; Field emission scanning electron microscopy; Heat sink applications; High thermal conductivity; Interfacial bonding; Scanning electron microscopic
KW  -  Thermal conductivity
A1  - Ahmad, F.
A1  - Aslam, M.
A1  - Raza, M.R.
A1  - Muhsan, A.S.
A1  - Shirazi, M.I.
SP  - 455
PB  - Trans Tech Publications Ltd
VL  - 564
ER  -