eprintid: 5027
rev_number: 2
eprint_status: archive
userid: 1
dir: disk0/00/00/50/27
datestamp: 2023-11-09 16:16:44
lastmod: 2023-11-09 16:16:44
status_changed: 2023-11-09 16:00:19
type: conference_item
metadata_visibility: show
creators_name: Afrooza, I.E.
creators_name: Binti Megat Yusoff, P.S.M.
creators_name: Ahmad, F.
creators_name: Muhsan, A.S.
title: A numerical analysis for predicting the thermal conductivity of carbon nanotube reinforced copper-matrix nanocomposites
ispublished: pub
keywords: Carbon nanotubes; Copper; Nanocomposites, Interfacial resistances; Numerical approaches; Representative volume element (RVE); Rule of mixture; Upper Bound, Thermal conductivity
note: cited By 3; Conference of 4th International Conference on Production, Energy and Reliability, ICPER 2014 ; Conference Date: 3 June 2014 Through 5 June 2014; Conference Code:106620
abstract: Thermal conductivity of carbon nanotubes (CNTs) copper-matrix nanocomposites was predicted by using numerical approach. In the present study, twenty representative volume elements (RVEs) were modeled by assuming that the CNTs are distributed homogeneously in the copper (Cu) matrix. It is assumed that each RVE contains different pattern of CNTs distribution while the direction, diameter and length of CNTs are held constant. The effect of the CNTs-matrix interfacial resistance was also negligible. Therefore, it was observed that the predicted values of thermal conductivity would reach to the upper-bound rule of mixtures. © 2014 Owned by the authors, published by EDP Sciences.
date: 2014
publisher: EDP Sciences
official_url: https://www.scopus.com/inward/record.uri?eid=2-s2.0-84905041858&doi=10.1051%2fmatecconf%2f20141304011&partnerID=40&md5=e2fd81980318572e49762143faa8387b
id_number: 10.1051/matecconf/20141304011
full_text_status: none
publication: MATEC Web of Conferences
volume: 13
place_of_pub: Kuala Lumpur
refereed: TRUE
issn: 2261236X
citation:   Afrooza, I.E. and Binti Megat Yusoff, P.S.M. and Ahmad, F. and Muhsan, A.S.  (2014) A numerical analysis for predicting the thermal conductivity of carbon nanotube reinforced copper-matrix nanocomposites.  In: UNSPECIFIED.