%0 Conference Paper
%A Malik, A.F.
%A Burhanudin, Z.A.
%A Jeoti, V.
%A Jamali, A.J.
%A Hashim, U.
%A Foo, K.L.
%D 2012
%F scholars:2500
%K Central frequency; Etching process; Feature sizes; Field emission secondary electron microscope; IDT; Interdigital transducer; LiNbO3; SAW delay line; Surface acoustic waves; Transfer characteristics; Transmission and reflection coefficient; Wet chemicals, Acoustic surface wave devices; Acoustic waves; Electromagnetism; Saws; Sensors; Ultrasonic transducers; Waves; Wet etching, Electric delay lines
%P 187-190
%R 10.1109/APACE.2012.6457657
%T Process-tolerant surface acoustic wave delay lines
%U https://khub.utp.edu.my/scholars/2500/
%X Surface Acoustic Wave (SAW) delay lines microfabrication is outlined and its characteristics due to wet chemical etching process variation are investigated. The SAW delay lines consist of Al inter-digital transducers (IDT) on LiNbO3 substrate. It is designed with specific IDT feature size to produce SAW at predetermined central frequency, f0. The effect of the etching process onto the IDT, in particular the feature size, is investigated using field emission secondary electron microscope (FESEM). The effect is then translated into transfer characteristics of the SAW delay lines by measuring its transmission and reflection coefficient using network analyzer. It is found that even with a �5 μm IDT feature size variation due to the wet chemical etching process, the fabricated delay lines can still produce SAW at the designed f0, and hence a process-tolerant SAW delay lines. © 2012 IEEE.
%Z cited By 0; Conference of 2012 5th IEEE Asia-Pacific Conference on Applied Electromagnetics, APACE 2012 ; Conference Date: 11 December 2012 Through 13 December 2012; Conference Code:95816