eprintid: 2427 rev_number: 2 eprint_status: archive userid: 1 dir: disk0/00/00/24/27 datestamp: 2023-11-09 15:50:39 lastmod: 2023-11-09 15:50:39 status_changed: 2023-11-09 15:43:30 type: conference_item metadata_visibility: show creators_name: Majid, M.F.M.A. creators_name: Khor, C.Y. creators_name: Abdullah, M.K. creators_name: Abdullah, M.Z. creators_name: Rahiman, W.Y. creators_name: Jappar, A. creators_name: Aris, M.S. title: Three dimensional numerical prediction of epoxy flow during the underfill process in flip chip packaging ispublished: pub keywords: Arrhenius temperature; Epoxy molding compounds; Flip-chip packaging; Generalized Newtonian fluid; Numerical predictions; Underfill process; Viscosity models; Volume tracking method, Electronics packaging; Filling; Industrial electronics; Manufacture, Three dimensional note: cited By 2; Conference of 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2012 ; Conference Date: 6 November 2012 Through 8 November 2012; Conference Code:97509 abstract: In the present paper, a 3D numerical prediction has been made to study the flip chip underfill process using the epoxy molding compound (EMC). The prediction considered the EMC filling behavior for the flow induced between the tiny gap of silicon die and substrate. Three different arrangements of the solder bump have been tested in this work. The EMC is treated as a generalized Newtonian fluid (GNF). The developed methodology combines the Kawamura and Kawahara technique, and the melt front volume tracking method to solve the two-phase flow field around the solder bumps. The Castro-Macosko rheology model with Arrhenius temperature dependence is adopted in the viscosity model. The predictions are made to investigate the filling patterns at several time intervals. The results show that the underfill process for solder bump with Type A gives minimum filling time and better filling yield. The effect of gap height between the plate and substrate on the underfill process also has been considered. The close agreement between prediction and experimental results from the previous work illustrates the applicability of the present numerical model. © 2012 IEEE. date: 2012 official_url: https://www.scopus.com/inward/record.uri?eid=2-s2.0-84879853708&doi=10.1109%2fIEMT.2012.6521810&partnerID=40&md5=5fda0a8632a2cdf8ed70dc8066178aa0 id_number: 10.1109/IEMT.2012.6521810 full_text_status: none publication: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium place_of_pub: Ipoh, Perak refereed: TRUE isbn: 9781467343848 issn: 10898190 citation: Majid, M.F.M.A. and Khor, C.Y. and Abdullah, M.K. and Abdullah, M.Z. and Rahiman, W.Y. and Jappar, A. and Aris, M.S. (2012) Three dimensional numerical prediction of epoxy flow during the underfill process in flip chip packaging. In: UNSPECIFIED.