eprintid: 2427
rev_number: 2
eprint_status: archive
userid: 1
dir: disk0/00/00/24/27
datestamp: 2023-11-09 15:50:39
lastmod: 2023-11-09 15:50:39
status_changed: 2023-11-09 15:43:30
type: conference_item
metadata_visibility: show
creators_name: Majid, M.F.M.A.
creators_name: Khor, C.Y.
creators_name: Abdullah, M.K.
creators_name: Abdullah, M.Z.
creators_name: Rahiman, W.Y.
creators_name: Jappar, A.
creators_name: Aris, M.S.
title: Three dimensional numerical prediction of epoxy flow during the underfill process in flip chip packaging
ispublished: pub
keywords: Arrhenius temperature; Epoxy molding compounds; Flip-chip packaging; Generalized Newtonian fluid; Numerical predictions; Underfill process; Viscosity models; Volume tracking method, Electronics packaging; Filling; Industrial electronics; Manufacture, Three dimensional
note: cited By 2; Conference of 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2012 ; Conference Date: 6 November 2012 Through 8 November 2012; Conference Code:97509
abstract: In the present paper, a 3D numerical prediction has been made to study the flip chip underfill process using the epoxy molding compound (EMC). The prediction considered the EMC filling behavior for the flow induced between the tiny gap of silicon die and substrate. Three different arrangements of the solder bump have been tested in this work. The EMC is treated as a generalized Newtonian fluid (GNF). The developed methodology combines the Kawamura and Kawahara technique, and the melt front volume tracking method to solve the two-phase flow field around the solder bumps. The Castro-Macosko rheology model with Arrhenius temperature dependence is adopted in the viscosity model. The predictions are made to investigate the filling patterns at several time intervals. The results show that the underfill process for solder bump with Type A gives minimum filling time and better filling yield. The effect of gap height between the plate and substrate on the underfill process also has been considered. The close agreement between prediction and experimental results from the previous work illustrates the applicability of the present numerical model. © 2012 IEEE.
date: 2012
official_url: https://www.scopus.com/inward/record.uri?eid=2-s2.0-84879853708&doi=10.1109%2fIEMT.2012.6521810&partnerID=40&md5=5fda0a8632a2cdf8ed70dc8066178aa0
id_number: 10.1109/IEMT.2012.6521810
full_text_status: none
publication: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
place_of_pub: Ipoh, Perak
refereed: TRUE
isbn: 9781467343848
issn: 10898190
citation:   Majid, M.F.M.A. and Khor, C.Y. and Abdullah, M.K. and Abdullah, M.Z. and Rahiman, W.Y. and Jappar, A. and Aris, M.S.  (2012) Three dimensional numerical prediction of epoxy flow during the underfill process in flip chip packaging.  In: UNSPECIFIED.