TY  - JOUR
Y1  - 2023///
N1  - cited By 3
A1  - Ayub, S.
A1  - Guan, B.H.
A1  - You, K.Y.
N2  - Shielding against electromagnetic interference is critical in everyday life, particularly in communication, radar, radio astronomy, and medical equipment. The electromagnetic pollution caused by current electronic devices is increasing rapidly, and it is difficult to achieve a stable and efficient material that can play a significant role at higher frequencies. Due to their lightweight, chemical stability, and outstanding microwave absorbing properties with the inclusion of carbon materials, conductive polymer composites are the most promising EMI shielding materials for overcoming this problem. The PVDF@MMG polymer composite was formed in this research using an ultrasonication process. Fourier transform infrared, thermogravimetric analysis, field emission scanning electron microscopy, vibrating sample magnetometer, and vector network analyzer were used to investigate the physicochemical properties of the composite. At higher frequencies, the obtained polymer nanocomposite demonstrated remarkable shielding effectiveness of 51.74 dB with a low thickness of 3 mmat 12â??18 GHz frequency range. The prepared nanocomposite has good EM stability across the frequency range, which is largely due to the filler's good dielectric and magnetic properties in the polymer matrix. © 2023 Elsevier Ltd
TI  - Electromagnetic interference shielding mechanisms of MMG@PVDF composites for a broadband frequency range
VL  - 35
KW  - Chemical stability; Electric network analyzers; Electrochemical impedance spectroscopy; Electromagnetic pulse; Electromagnetic shielding; Electromagnetic wave interference; Field emission microscopes; Filled polymers; Nanocomposites; Polymer matrix composites; Radio interference; Thermogravimetric analysis
KW  -  'current; Broadband frequency; Electro magnetic pollution; Electromagnetic interference shielding; EMI; Frequency ranges; High frequency HF; Ku band; P.V.D.F; Polymer composite
KW  -  Scanning electron microscopy
ID  - scholars18499
UR  - https://www.scopus.com/inward/record.uri?eid=2-s2.0-85162196506&doi=10.1016%2fj.mtcomm.2023.106273&partnerID=40&md5=0b7d9fdabaeb0736fe601b4f7ffcdf98
AV  - none
JF  - Materials Today Communications
ER  -