TY  - JOUR
N2  - With the rapid advancement of microprocessor speed and performance, the requirement for effective microprocessor cooling becomes prominent to maintain the processor optimum performance and integrity. This study investigates laminar heat transfer performance of a novel electronic liquid cooling with phase change material as thermal capacitor by adopting computational fluid dynamics approach. Two cooling channel designs are evaluated, i.e. parallel and serpentine channels with phase change material. The effect of phase change material and cooling channel configuration will be investigated. In addition, the effect of channel inlet Reynolds number is evaluated for liquid cooling channel with and without phase change material. The result indicates that the additional phase change material in a cooling channel does offer superior cooling performance, indicated by the lower average temperature than that without PCM. Consistent with other studies, convective heat transfer is increased with increasing Reynolds number. On the channel design, the serpentine channel offers better heat transfer performance with the penalty of higher pressure drop and thus higher pumping power than parallel channel. © 2021, The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.
KW  - Computational fluid dynamics; Electronic cooling; Heat convection; Phase change materials; Reynolds number; Serpentine
KW  -  Channel design; Convective heat transfer; Cooling channels; Heat transfer performance; Laminar convective heat transfer; Liquid cooling; Liquid cooling channel; Microprocessor heat dissipation; Parallel channel; Serpentine channel
KW  -  Liquids
ID  - scholars15800
UR  - https://www.scopus.com/inward/record.uri?eid=2-s2.0-85104407490&doi=10.1007%2f978-981-15-9505-9_40&partnerID=40&md5=7bee0b24f2b28624ea55ea23453df28a
JF  - Lecture Notes in Mechanical Engineering
A1  - Medhi, N.S.
A1  - Haryoko, L.A.F.
A1  - Kurnia, J.C.
VL  - 46
Y1  - 2021///
N1  - cited By 0; Conference of Innovative Manufacturing, Mechatronics and Materials Forum, iM3F 2020 ; Conference Date: 6 August 2020 Through 6 August 2020; Conference Code:255839
SP  - 451
TI  - Numerical Investigation of Electronic Cooling with Phase Change Material
AV  - none
EP  - 461
SN  - 21954356
PB  - Springer Science and Business Media Deutschland GmbH
ER  -