relation: https://khub.utp.edu.my/scholars/14986/ title: A review of graphene reinforced Cu matrix composites for thermal management of smart electronics creator: Ali, S. creator: Ahmad, F. creator: Yusoff, P.S.M.M. creator: Muhamad, N. creator: Oñate, E. creator: Raza, M.R. creator: Malik, K. description: Heat dissipation remains a key challenge to be addressed, determining the performance and durability of smart electronic devices. Graphene reinforced metal matrix composites have been extensively studied as a thermal management material due to their high thermal conductivity and low coefficient of thermal expansion. The emphasis of this review is pivoted on the thermal conductivity enhancement of graphene reinforced Cu matrix composites developed in the recent literature. An overview of factors affecting thermal conductivity of composite namely defect processing route, density, graphene derivative, lateral size, concentration, alignment, graphene/matrix interfacial bonding and graphene modification are discussed. An extensive weightage is given to the processing route as it is the most influential factor in determining the enhancement efficiency. Furthermore, graphene based functional products such as heat spreader and heat sink developed for heat dissipation of electronic devices are also reviewed. Finally, the development and outlook for graphene based Cu composites are presented. © 2021 Elsevier Ltd publisher: Elsevier Ltd date: 2021 type: Article type: PeerReviewed identifier: Ali, S. and Ahmad, F. and Yusoff, P.S.M.M. and Muhamad, N. and Oñate, E. and Raza, M.R. and Malik, K. (2021) A review of graphene reinforced Cu matrix composites for thermal management of smart electronics. Composites Part A: Applied Science and Manufacturing, 144. ISSN 1359835X relation: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85101896828&doi=10.1016%2fj.compositesa.2021.106357&partnerID=40&md5=ea63a56ddaceb66c9d5630e12b743cca relation: 10.1016/j.compositesa.2021.106357 identifier: 10.1016/j.compositesa.2021.106357