@article{scholars12219,
         journal = {International Journal for Simulation and Multidisciplinary Design Optimization},
       publisher = {EDP Sciences},
           title = {Three-dimensional stress-based topology optimization using SIMP method},
            year = {2019},
             doi = {10.1051/smdo/2019005},
          volume = {10},
            note = {cited By 5},
        keywords = {3D modeling; Finite element method; Sensitivity analysis; Shape optimization; Structural optimization, Bench-mark problems; Developed model; Optimal topologies; Stress constraints; Structural topology optimization; Three-dimensional analysis; Three-dimensional stress; Two-dimensional stress, Topology},
             url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-85062919824&doi=10.1051\%2fsmdo\%2f2019005&partnerID=40&md5=33392e4bbc5e59fbce9b9534e6d5e96f},
        abstract = {Structural topology optimization problems have been formulated and solved to minimize either compliance or weight of a design domain under volume or stress constraints. The introduction of three-dimensional analysis is a more realistic approach to many applications in industry and research, but most of the developments in stress-based topology optimization are two-dimensional. This article presents an extension of two-dimensional stress-based topology optimization into three-dimensional using SIMP method. The article includes a mathematical model for three-dimensional stress-based topology optimization problems and sensitivity analysis. The article also includes finite element analysis used to compute stress induced in the design domains. The developed model is validated using benchmark problems and the results are compared with three-dimensional compliance-based formulation. From the results, it was clear that the developed model can generate optimal topologies that can sustain applied loads under the boundary conditions defined. {\^A}{\copyright} 2019 H.S. Gebremedhen et al.},
            issn = {17796288},
          author = {Gebremedhen, H. S. and Woldemicahel, D. E. and Hashim, F. M.}
}