eprintid: 12095
rev_number: 2
eprint_status: archive
userid: 1
dir: disk0/00/01/20/95
datestamp: 2023-11-10 03:26:38
lastmod: 2023-11-10 03:26:38
status_changed: 2023-11-10 01:16:52
type: conference_item
metadata_visibility: show
creators_name: Liew, C.F.
creators_name: Prakash, J.
creators_name: Kamaruddin, S.
creators_name: Ong, K.S.
title: Deployment of an FMEA-Integrated Framework to Improve Operational Performance in Semiconductor Manufacturing: A Case Study
ispublished: pub
keywords: Condensed matter physics; Engineering; Industrial engineering; Materials science, Design for manufacturing and assemblies; Failure mode effect analysis; Integrated frameworks; Manufacturing industries; Operational performance; Overall equipment efficiency; Semiconductor manufacturers; Semiconductor manufacturing, Semiconductor device manufacture
note: cited By 1; Conference of International Conference on Recent Advances on Industrial Engineering and Manufacturing 2018, ICRAIEM 2018 ; Conference Date: 12 December 2018 Through 13 December 2018; Conference Code:149896
abstract: The failure mode effect analysis (FMEA) aims to strengthen the operational performance of a process of a product. However, current FMEA practice does not quantify the achievement in operational performances. Risk priority number (RPN), the only success indicator of FMEA, is independent of operational performance monitoring. Thus, the capability of FMEA to strengthen operational performance may be ineffectual unless it demonstrates a quantifiable improvement in operational performance. This study offered guidelines for manufacturing industry to quantify the operational performance within the FMEA methodology by operational performance indicator (OPI). In tandem with RPN, the OPI in FMEA ascertains the priority set by RPN and defines more refined priority than RPN. Design for manufacturing and assembly (DFMA) and Poka-yoke provide systematic guidelines for developing corrective actions for eliminating or reducing the occurrence of failure while strengthening current control to prevent the delivery of any non-conformance to customers. Application of the new FMEA-based integrated framework in a semiconductor manufacturer in Malaysia demonstrated that 69.2 improved the overall equipment efficiency (OEE). © 2019 IOP Publishing Ltd. All rights reserved.
date: 2019
publisher: Institute of Physics Publishing
official_url: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85070247823&doi=10.1088%2f1757-899X%2f530%2f1%2f012040&partnerID=40&md5=bdc9e9345d64137983d8d911e1b68b7a
id_number: 10.1088/1757-899X/530/1/012040
full_text_status: none
publication: IOP Conference Series: Materials Science and Engineering
volume: 530
number: 1
refereed: TRUE
issn: 17578981
citation:   Liew, C.F. and Prakash, J. and Kamaruddin, S. and Ong, K.S.  (2019) Deployment of an FMEA-Integrated Framework to Improve Operational Performance in Semiconductor Manufacturing: A Case Study.  In: UNSPECIFIED.