eprintid: 11727
rev_number: 2
eprint_status: archive
userid: 1
dir: disk0/00/01/17/27
datestamp: 2023-11-10 03:26:15
lastmod: 2023-11-10 03:26:15
status_changed: 2023-11-10 01:15:57
type: article
metadata_visibility: show
creators_name: Meyghani, B.
creators_name: Awang, M.
creators_name: Emamian, S.
creators_name: Plank, B.
creators_name: Christoph, H.
creators_name: Siow, K.S.
title: Stress analysis of nano porous material using computed tomography images Spannungsanalyse von nanoporösem Material mittels Computertomographie-Aufnahmen
ispublished: pub
keywords: Computerized tomography; Porous materials; Silver; Sintering; Stress analysis, Computed tomography images; Finite element modelling; Internal forces; Material integrity; Materials resistance; Nano-porous materials; Physical behaviors; Stress behavior, Finite element method
note: cited By 3
abstract: Sintered silver materials possess an advantage that allows excellent bonding between chips and their substrate. Stress manifests as the materials resistance against external and internal forces, however during stress analysis the complex physical behavior caused by the forces and the nature of the material is often disregarded by researchers. This paper analyses the stress behavior of nano porous sintered silver in X and Y directions using finite element modelling. This study also focuses on observing the growth of the crack in samples in different directions. It is found that the occurrence of the cracks in the specimens starts at the peak stress point and the failure is observed at the largest void. It is also detected that the stress across the whole area of the model is regularly distributed in those samples which have relatively smaller voids. Thus, these samples have a better material integrity. In addition, this fact indicates that the material in these sample could hold higher levels of stress. Finally, the level of the stress and the possibility of failure in those samples that have smaller voids is found to be less than others. © 2019 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim
date: 2019
publisher: Wiley-VCH Verlag
official_url: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85062682079&doi=10.1002%2fmawe.201800206&partnerID=40&md5=63233d088bd1dbf9e5cab843229fa01b
id_number: 10.1002/mawe.201800206
full_text_status: none
publication: Materialwissenschaft und Werkstofftechnik
volume: 50
number: 3
pagerange: 234-239
refereed: TRUE
issn: 09335137
citation:   Meyghani, B. and Awang, M. and Emamian, S. and Plank, B. and Christoph, H. and Siow, K.S.  (2019) Stress analysis of nano porous material using computed tomography images Spannungsanalyse von nanoporösem Material mittels Computertomographie-Aufnahmen.  Materialwissenschaft und Werkstofftechnik, 50 (3).  pp. 234-239.  ISSN 09335137