This paper presents a study on various signal integrity (SI) issues that could affect signals on Printed Circuit Boards (PCBs). This paper is aimed to analyze and have a better understanding on the nature of signal integrity, how the problem is manifested in PCB designs and what design solutions can be employed to minimize its effects. The PCB designs are modelled using the Advanced Design System (ADS). PCB fabrication and testing on the Digital Communication Analyzer (DCA) follows up and the results obtained coincide with theoretical claims obtained at the initial stage of this paper.