New thermal management solutions are required to provide cost-effective means of dissipating heat from next generation microelectronic devices. In this paper, fabrication of heat sink nanocomposite made of copper reinforced by multiwalled carbon nanotubes up to 10 Vol. using metal injection molding technique is presented. A mixture of Cu-MWNTs was compounded using internal mixer machine for homogenous dispersion of the solid powder in the binder. To ensure a flow able feedstock during injection molding process, different binder systems and their Cu-MWNTs feedstocks were examined using capillary rheometer machine. In order to avoid binder degradation, TGA test was carried out. The TGA results showed that the processing temperature such as mixing and injection molding should be lower than 170°C. The injection molding was carried out at low pressure. A combination of solvent and thermal debinding was used for binder removal, and then the samples were isothermally sintered at different sintering temperatures (900-1050°C) in argon atmosphere. The results showed that the sintered samples experienced an isotropic shrinkage around 17 with relatively homogeneous dispersion of MWNTs in the copper matrix which is expected to enhance the physical and mechanical properties of the final product. © 2012 Asian Network for Scientific Information.