Recent advancements in the development of microprocessors have resulted in the design of smaller microchips with improved performance. The new designs require proper cooling systems to prevent performance degradation and permanent damage to the chips. Extended surfaces, including fin, pin, or metal foam, are one of the prominent approaches in cooling systems designs. So far, there has been limited research, especially considering pore-scale analysis on the combination of pin/fin with metal foam, which is expected to offer promising cooling performance. This study aims to evaluate the performance of pinned metal foam heat sinks with dielectric coolant as a potential cooling system for microchips. A three-dimensional pore-scale numerical model is developed to analyze the performance of the proposed heat sinks. The effect of different parameters such as Reynolds number, heat flux, pore density, and different pin shapes are investigated. The results reveal that at a Reynolds number of 100, almost all the metal foam heat sinks enhance the heat transfer performance, which can be as large as 22 in some cases. Furthermore, adding pins increases the heat energy dissipation with a slight penalty of pressure drop depending on its hydrodynamic adaptation. Too dense or loose metal foam either increases the pressure drop or decreases the heat transfer rate, deviating from the optimum range. Lastly, it is revealed that heat flux from the heater does not significantly change the performance of the pinned metal foam heat sinks. © 2023