Current Microhotplates have large power consumptions, temperature uniformity problems, and are highly priced; additionally, special stages are required to be integrated with ICs. The modeling and design of a MEMS Microhotplate (MHP) using standard 0.18 µm IP4M CMOS process technology is discussed in this paper. The designed MHP is intended to achieve good temperature uniformity while dissipating little power. The MHP microbridges lengths are varied from 80 μm to 120 μm whereas the MHP microbridges widths are varied from 5 μm to 25 μm. The effect of the length and width are studied and three different lengths of micro heater 15560 µm, 24360 µm, 35160 µm, and 5 µm width were studied. The optimized design with microbridges of 100 µm length and 25 µm width and a heater length of 15560 µm is selected. The power dissipation and operating temperature were measured using mathematical modeling and actuation voltages ranging from 0.2 V to 1 V. The modeling estimates MHP power dissipation ranging from 0.264 mW to 3.181 mW at operating temperatures ranging from 11.12 oC to 277.92 oC. © 2021 NSP.