FEM analysis of various multilayer structures for CMOS compatible wearable acousto-optic devices

Hanif, M. and Jeoti, V. and Ahmad, M.R. and Aslam, M.Z. and Qureshi, S. and Stojanovic, G. (2021) FEM analysis of various multilayer structures for CMOS compatible wearable acousto-optic devices. Sensors, 21 (23). ISSN 14248220

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Abstract

Lately, wearable applications featuring photonic on-chip sensors are on the rise. Among many ways of controlling and/or modulating, the acousto-optic technique is seen to be a popular technique. This paper undertakes the study of different multilayer structures that can be fabricated for realizing an acousto-optic device, the objective being to obtain a high acousto-optic figure of merit (AOFM). By varying the thicknesses of the layers of these materials, several properties are discussed. The study shows that the multilayer thin film structure-based devices can give a high value of electromechanical coupling coefficient (k2) and a high AOFM as compared to the bulk piezoelectric/optical materials. The study is conducted to find the optimal normalised thickness of the multilayer structures with a material possessing the best optical and piezoelectric properties for fabricating acousto-optic devices. Based on simulations and studies of SAW propagation characteristics such as the electromechanical coupling coefficient (k2) and phase velocity (v), the acousto-optic figure of merit is calculated. The maximum value of the acousto-optic figure of merit achieved is higher than the AOFM of all the individual materials used in these layer structures. The suggested SAW device has potential application in wearable and small footprint acousto-optic devices and gives better results than those made with bulk piezoelectric materials. © 2021 by the authors. Licensee MDPI, Basel, Switzerland.

Item Type: Article
Additional Information: cited By 1
Uncontrolled Keywords: Acoustic surface wave devices; Acoustic waves; Aluminum nitride; CMOS integrated circuits; Electromechanical coupling; Electromechanical devices; Film preparation; Finite element method; II-VI semiconductors; III-V semiconductors; Lithium compounds; Multilayers; Niobium compounds; Piezoelectricity; Zinc oxide, Acousto optic devices; Acousto-optics; COMSOL; Coupling coefficient (k); Electromechanical coupling coefficients; Fem analyze; Figure of merit; Multilayer structures; Piezoelectric; SAW, Silica, device failure analysis; electronic device; equipment design; optics; transducer, Equipment Design; Equipment Failure Analysis; Optics and Photonics; Transducers; Wearable Electronic Devices
Depositing User: Mr Ahmad Suhairi UTP
Date Deposited: 10 Nov 2023 03:28
Last Modified: 10 Nov 2023 03:28
URI: https://khub.utp.edu.my/scholars/id/eprint/14177

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